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Single Chip ADC DAC Integrated Module

Single Chip ADC DAC Integrated Module
Details:
CPU Core: ARM® Cortex®-M0, 32-bit RISC core.
Main frequency speed: up to 48MHz, providing powerful processing performance and response speed.
Flash memory: 64KB, used for storing program code.
SRAM: 8KB for data storage.
Operating voltage range: 2.0V to 3.6V.
Operating temperature: -40°C to +85°C (or -40°C to +105°C depending on package and version).
Package Type: Various package forms are available, such as UFQFPN-32 (5x5mm), LQFP32_7X7MM, etc.
Total number of pins: 32 pins (the specific number of pins may vary depending on the package).
Communication interfaces: up to 2 I²C interfaces, 2 SPI interfaces, 1 I²S interface, 1 HDMI CEC interface and 2 USART interfaces.
Analog-to-digital converter (ADC): 12-bit ADC with up to 16 channels and a conversion time of 1.0μs.
Digital to Analog Converter (DAC): 12-bit DAC.
Timers: Up to 11 timers, including 16-bit advanced control timers (PWM output), 32-bit and 16-bit timers, etc.
Other peripherals: including DMA controller, POR, PWM, WDT, etc.
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Description
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Introduction

The Single Chip ADC DAC Integrated Module is a single-chip module that integrates a high-precision ADC and DAC. Based on the ARM Cortex-M0 core and operating at 48MHz, it is widely used in industrial control, intelligent instruments, and consumer electronics.

 

Fast Response
Based on an ARM Cortex-M0 processor with a 48MHz clock speed, it offers fast processing speeds and ensures industrial-grade real-time control.

 

High-Precision ADC
12-bit ADC with up to 16 channels supports fast sampling and ensures accurate signal conversion.

 

Multiple Interfaces

I²C, SPI, I²S, HDMI CEC, and USART interfaces support multi-device connectivity.

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Application Scenarios

Industrial Control Equipment: Motor drives, PLC expansion modules, and process control systems.

Smart Instrumentation: High-precision measurement and data acquisition systems.

Consumer Electronics: Audio processing and home appliance control modules.

IoT Terminals: Sensor nodes and smart monitoring devices.

 

Customization Options
Storage Configuration: Optional extended SPI Flash or Quad SPI storage options.

Interface Customization: The number of I²C, SPI, and I²S interfaces can be adjusted to meet customer needs.

Packaging: Various sizes and pinouts are supported to easily match device designs.

 

Company Strengths
Industry Experience: Founded in 2008, we have nearly two decades of experience in the electronic components and PCB fields.

 

Production Capacity: We can manufacture PCBs up to 32 layers, covering a variety of materials including FR-4, FPC, high-frequency boards, copper substrates, and aluminum substrates.

 

Advanced Equipment: We have high-speed SMT placement machines, AOI inspection, reflow soldering, CNC machining centers, and laser cutting machines to ensure efficiency and precision.

 

Quality Certification: We are ISO 9001, ISO 14001, and ISO 45001 certified, and some products are RoHS and CE certified.

 

Customer Trust: We have long-term partnerships with numerous international OEMs and distributors, and our products and services are widely recognized.

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